BITHAN熱壓封裝機(膠合熱壓機)

1.  採用溫控可調時間控制器。
2. 立即停止防呆裝置。
3.  氣壓式可調整壓合裝置。
4. 壓合壓力可調，整調整範圍：1~5 Kgf/cm (以內)。
5. 加熱系統之溫度控制在常溫~250℃以內(自由設定)。
6. 設有緊急自動停止保護裝置 。

• 機台尺寸:客製
• 有效封裝面積：60mm×60mm or 120㎜×120㎜
• 加工範圍： 50~150mm 客製
•  使用電壓： AC110V 50/60HZ
• 使用空壓： 8bar以內 (購買者需自備空壓來源:如空壓機或氮氣)
• DSSC surlyn (BITHAN) HEAT PRESS DEVICE description:
• Applicable object: thermocompression heat curing liquid crystal panel package solar dye sensitized battery package
• Temperature controlled adjustable time controller.
• Stop the foolproof device immediately.
• Pneumatic adjustable press fit.
• The pressing pressure is adjustable, and the whole adjustment range is 1~5 Kgf/cm (within).
• The temperature of the heating system is controlled within the normal temperature ~250 °C (free setting).
• Emergency emergency stop protection is available.
• Machine size 300mmx200mmx570mm 12kg
• Effective packaging area: 60mm × 60mm or 120mm × 120mm
• Processing range: 50~150mm custom
• Operating voltage: AC110V 50/60HZ
• Use air pressure: 8bar or less (purchasers need to bring their own air pressure source: such as air compressor or nitrogen)