BITHAN熱壓封裝機(膠合熱壓機)
DSSC surlyn (BITHAN) 熱壓封裝機 (精密壓膜機, 膠合熱壓機) 機台說明:
適用對象:熱壓合 熱固化 液晶面板封裝 太陽能染料敏化電池封裝 電子產業 玻璃面板 鋁板 偏光板 塑膠板 裝飾板
壓克力、不銹鋼板 印刷電路板 塑合木心板等產品之貼膜
- 採用溫控可調時間控制器。
- 立即停止防呆裝置。
- 氣壓式可調整壓合裝置。
- 壓合壓力可調,整調整範圍:1~5 Kgf/cm (以內)。
- 加熱系統之溫度控制在常溫~250℃以內(自由設定)。
- 設有緊急自動停止保護裝置 。
- 機台尺寸:客製
- 有效封裝面積:60mm×60mm or 120㎜×120㎜
- 加工範圍: 50~150mm 客製
- 使用電壓: AC110V 50/60HZ
- 使用空壓: 8bar以內 (購買者需自備空壓來源:如空壓機或氮氣)
- DSSC surlyn (BITHAN) HEAT PRESS DEVICE description:
- Applicable object: thermocompression heat curing liquid crystal panel package solar dye sensitized battery package
- Temperature controlled adjustable time controller.
- Stop the foolproof device immediately.
- Pneumatic adjustable press fit.
- The pressing pressure is adjustable, and the whole adjustment range is 1~5 Kgf/cm (within).
- The temperature of the heating system is controlled within the normal temperature ~250 °C (free setting).
- Emergency emergency stop protection is available.
- Machine size 300mmx200mmx570mm 12kg
- Effective packaging area: 60mm × 60mm or 120mm × 120mm
- Processing range: 50~150mm custom
- Operating voltage: AC110V 50/60HZ
- Use air pressure: 8bar or less (purchasers need to bring their own air pressure source: such as air compressor or nitrogen)