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Precision Hot Press Bonding & Sealing Machine

High-precision thermal bonding solution for DSSC, LCD, and electronic components.
Up to 250°C
1-5 Kgf/cm²
Customized Design

Applications

Technical Specifications

Parameter

Speciflcation

Effective Sealing Area:

60mmX 60mm / 120mmX 120mm

Pressure Range:

1~ 5 Kgf/cm

Temperature:

Ambient to 250°C

Power:

AC110V   50/60Hz

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