Up to 250°C
1-5 Kgf/cm²
Customized Design
Watch the 6-step operation demo (0:43)
Parameter
Specification
Effective Sealing Area:
60 mm × 60 mm / 120 mm × 120 mm
Pressure Range:
1–5 kgf/cm²
Temperature:
Ambient to 250°C
Power:
AC110V 50/60Hz
A hot press sealing machine uses heat and pressure to bond or seal materials. This machine suits precision processes that need controlled temperature and pressure, with effective sealing areas of 60 × 60 mm and 120 × 120 mm.
Common applications include DSSC solar cell packaging, LCD panel bonding, and PCB and electronic component lamination.
Temperature ranges from ambient to 250°C, and pressure ranges from 1 to 5 kgf/cm².
Two sizes are available: 60 × 60 mm and 120 × 120 mm.
AC110V 50/60Hz.
Yes. Temperature, pressure and other specifications can be planned around your product materials and process requirements.
Related equipment: Vacuum Hydrogen Meter and custom automation equipment
